8. Feb, 2024 | News
Supported by the U.S. National Science Foundation (NSF)-MRI program, the Center for Nanoscale Systems (CNS) -Nanofabrication Facility at Harvard University has acquired Vanguard Automation’s SYMPHONY, a fully automated photonic integration and packaging solution...
13. Sep, 2023 | News
September 13, 2023: PIC Magazine – Issue 3, 2023 The rapid growth of photonic integrated circuits is driving the need for fast innovation, and this is made possible by the development of Photonic Wire Bonding (PWB), which creates low-loss, 3D free-form connections...
14. Jul, 2023 | News
In this paper, our partner at UBC, Professor Lukas Chrostowski and team use photonic wire bonding (PWB) to make reliable and efficient optical connections between single mode fiber (SMF) and silicon photonic circuits down to 970 mK. The results presented show that...
7. Mar, 2023 | News
Kate Gleason College of Engineering at the Rochester Institute of Technology has acquired Vanguard Automation’s SONATA 1000, a fully automated 3D Lithography system for enabling photonic integration and packaging via Photonic Wire Bonding and Facet-Attached Micro...
6. Mar, 2023 | News
Karlsruhe, Germany and Toronto, Ontario, March 6, 2023 — Vanguard Automation GmbH, the developer of 3D-nanoprinted Photonic Wire Bond and Micro-Lens technology and manufacturer of software-defined equipment for photonic integration and packaging and POET Technologies...
13. Feb, 2023 | News
Wafer-level mass production of photonic integrated circuits (PIC) has become a technological mainstay in the field of optics and photonics, enabling many novel and disrupting a wide range of existing applications. However, scalable photonic packaging and system...
