Applications & Markets

Telecom
Datacom

In today’s hyper-connected world, photonic solutions are emerging as the preferred method for overcoming bandwidth bottlenecks

3D sensing devices demand unique packaging solutions due to their diverse and often non-standard requirements

The exponential increase in demand for increased data processing power and reduced latency is driven by AI and ML

The Quantum revolution presents unique challenges and critical optical loss budgets requiring innovative manufacturing methods

Our advanced packaging and integration technologies provide the reliability and performance necessary for harsh environments