Photonic wire bonds and facet attached micro-lenses are 3D freeform structures that maintain low-loss optical connectivity and high reliability for photonic packaging and integration. These attributes are critical for mass production of compact optoelectronic devices....
Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss, reproducibility, high reliability and packaging compatibility. These attributes are crucial for high-volume production of...
November 4, 2024: Silicon Semiconductor Magazine – Issue 8 Vanguard Automation is enabling a bright future for photonic packaging and integration with scalable industry-ready 3D nano-printing solutions. OUR TECHNOLOGY DRIVEN world of AI (Artificial Intelligence),...
Karlsruhe, Germany and Lausanne, Switzerland, September 16th, 2024 – Photonic Integrated Circuits (PICs) have been demonstrated with very low on-chip loss in the past, for example with LIGENTEC’s low loss silicon nitride (SiN) PIC platform. The connection of these...
Karlsruhe, Germany, May 15th, 2024 — Vanguard Automation (VA), a Mycronic company, is delighted to announce today that the vanguard SYMPHONY has been successfully commissioned at C2MI, Canada’s largest electronic system research and development centre. This equipment...
Karlsruhe, Germany, April 15, 2024 — Vanguard Automation, a Mycronic company, is delighted to announced today that its 3D lithography system, SONATA 1000, has been successfully commissioned at Tyndall National Institute. The PIXAPP pilot line, headquartered at Tyndall...
