Vanguard Automation and ETRI Partner to Drive Scalable Photonic Integration in Korea

23. Oct, 2025 | News

Karlsruhe, Germany / Daejeon, Korea – October 22, 2025 Vanguard Automation (VA) is delighted to announced today that vanguard’s 3D lithography system has been installed at the Electronics and Telecommunications Research Institute (ETRI) in Korea. This milestone...

Fraunhofer IZM: A bright future for quantum computing with Photonic Wire Bonding

10. Sep, 2025 | News

Fraunhofer IZM, September 2025 Great to see Photonic Wire Bonding technology fabricated with our vanguard Sonata1000 in action for optical quantum processors! Congrats to our partner Fraunhofer IZM and Akhetonics for their SPOC project! Read more here...

The Essential Link in Next-Generation Optical Connectivity

10. Sep, 2025 | Magazine Articles, News

PIC Magazine Issue 3, September 2025 With industry-ready 3D nano-printing solutions, Vanguard Automation is lighting the path to scalable and reliable processes for integrating active components to PICs Demand is surging for high-performance optics and PICs, driven by...

Vanguard Automation joins MEETOPTICS to expand access to photonics innovation

3. Jul, 2025 | News

Vanguard Automation has officially joined MEETOPTICS, the global platform for optics and photonics. This partnership supports our mission to make advanced multi-chip integration and packaging solutions more accessible to engineers and researchers worldwide, empowering...

Industry Proven Photonic Integration Using Photonic Wire Bonds & Facet Attached Micro-Lenses

18. Dec, 2024 | News

Photonic wire bonds and facet attached micro-lenses are 3D freeform structures that maintain low-loss optical connectivity and high reliability for photonic packaging and integration. These attributes are critical for mass production of compact optoelectronic devices....

Using Industry Ready Photonic Wire Bonds & Facet Attached Micro-Lenses

11. Dec, 2024 | News

Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss, reproducibility, high reliability and packaging compatibility. These attributes are crucial for high-volume production of...