In this paper, our partner at UBC, Professor Lukas Chrostowski and team use photonic wire bonding (PWB) to make reliable and efficient optical connections between single mode fiber (SMF) and silicon photonic circuits down to 970 mK.
The results presented show that PWBs can be used at such low temperatures with low loss, high bandwidth, and mechanically robust performance. This method alleviates the strict alignment challenge that occurs during assembling and cool down experienced by other packaging methods. Additional features such as UHV, vacuum bakeout compatibility and robustness to thermal cycling make PWB a promising new photonic packaging technique for a wide range of applications and operating conditions.