About Vanguard Automation
The company develops process technology and software-defined manufacturing equipment for photonic integration and packaging. Building on advanced nano-printing technology, VA solutions complement planar photonic integrated circuits (PIC) by 3D freeform structures such as Photonic Wire Bonds and Micro-Optical Lenses. This technology is key to chiplet-based photonic systems that offer high packaging density and increased design flexibility, while being amenable to automated high-volume fabrication.
The technology has been researched at the Karlsruhe Institute of Technology (KIT) for almost one decade. Vanguard Automation GmbH was founded in 2017 as a joint venture of Vanguard Photonics GmbH and ficonTEC Service GmbH.
Solutions & Capabilities
Modular machine and software capabilities for scalable manufacturing
3D printing of freeform waveguides and micro-optical elements are revolutionizing photonic packaging and system assembly. Vanguard Automation offers the first industrial solution for in-situ printing of Photonic Wire Bonds (PWB) and facet-attached micro-optical elements.
Applications & Technologies
Assembly and packaging solutions for photonic integrated circuits
Photonic Wire Bonding
Photonic wire bonding (PWB) exploits advanced three-dimensional (3D) nano-printing of single-mode interconnect waveguides between coarsely pre-positioned elements, thereby enabling highly efficient interfaces between waveguides of vastly different mode field profiles in a fully automated process.
News & Events
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Optical Product Innovation Accelerates
February 15, 2022: Vanguard Automation, C2MI, and AEPONYX announce plans to jointly accelerate the innovation of photonic integrated circuits by deploying Photonic Wire Bonding on a broader scale.