About Vanguard Automation
The company develops process technology and software-defined manufacturing equipment for photonic integration and packaging. Building on advanced nano-printing technology, VA solutions complement planar photonic integrated circuits (PIC) by 3D freeform structures such as Photonic Wire Bonds and Micro-Optical Lenses. This technology is key to chiplet-based photonic systems that offer high packaging density and increased design flexibility, while being amenable to automated high-volume fabrication.
The technology has been researched at the Karlsruhe Institute of Technology (KIT) for almost one decade. Vanguard Automation GmbH was founded in 2017 as a joint venture of Vanguard Photonics GmbH and ficonTEC Service GmbH.
Solutions & Capabilities
Modular machine and software capabilities for scalable manufacturing
3D printing of freeform waveguides and micro-optical elements is about to revolutionize photonic packaging and system assembly. Vanguard Automation offers the first industrial solution for in-situ printing of Photonic Wire Bonds (PWB) and facet-attached micro-optical elements.
Applications & Technologies
Assembly and packaging solutions for photonic integrated circuits
Photonic Wire Bonding
Photonic wire bonding (PWB) exploits advanced three-dimensional (3D) nano-printing of single-mode interconnect waveguides between coarsely pre-positioned elements, thereby enabling highly efficient interfaces between waveguides of vastly different mode field profiles in a fully automated process.
News & Events
Get in contact with us and learn how we came here
Alois Hauk has handed over his baton as CEO of Vanguard Automation to Thorsten Mayer
The Board of Vanguard Automation announces Thorsten Mayer as new Chief Executive Officer, effective November 1, 2021.