Materials

Materials – Complete Solution for photonic packaging

In-house developed photoresist and materials series with full traceability.  Compatable with all optical materials and PIC material platforms.

Specifically designed to meet stringent industrial and environmental reliability standards (GR-CORE-468) and suitable for cryogenic applications.

VanCore Series

Negative tone photoresists for fabrication of Photonic Wire Bonds and micro lenses

VanClad Series

Protective over-cladding for Photonic Wire Bond encapsulation