September 13, 2023: PIC Magazine – Issue 3, 2023
The rapid growth of photonic integrated circuits is driving the need for fast innovation, and this is made possible by the development of Photonic Wire Bonding (PWB), which creates low-loss, 3D free-form connections between optical components. Just as electrical integrated circuits have benefitted from electronic wire bonding, photonics innovations will now advance on a faster trajectory with PWB.
Built on advanced 3D nano-printing technology, PWB is inherently a fully automated process and provides a high degree of design flexibility.