Photonic wire bonds and facet attached micro-lenses are 3D freeform structures that maintain low-loss optical connectivity and high reliability for photonic packaging and integration. These attributes are critical for mass production of compact optoelectronic devices.
With the increasing demand to deliver more data at faster transmission rates, key enabling technologies are required to produce optoelectronic devices that are more efficient and compact with reduced power consumption. One such technology is photonic integrated circuits (PIC), utilizing state-of-the art active and passive devices. A technical hurdle for packaging PICs in hybrid multi-chip modules is to have low-loss, reproducible, and reliable optical connections. Multi-chip modules usually contain devices fabricated on different material platforms, meaning that achieving low optical coupling loss requires mode field matching of the individual components and precise alignment between devices. Traditional photonics packaging solutions have been bulky, expensive and required complex alignment and integration processes, meaning overcoming scalability and increasing production yields remains a challenge. Addressing these integration and packaging challenges is crucial to advance the mass production of hybrid multi-chip modules and ensure high yield and reliability.
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