Integrated Non-sliced OAWM Engine Enabling 320 GHz Photonic-Electronic Analog-to-Digital Conversion

24. Mar, 2024 | Conference Publications

D. Drayss et al., in Optical Fiber Communication Conference (OFC) 2024, Technical Digest Series (Optica Publishing Group, 2024), paper W3B.4 (24-28 March 2024) We demonstrate an optically and electrically packaged silicon photonic receiver system for non-sliced...

Vanguard Automation signs Agreement to join the Swedish High-Tech Group Mycronic

22. Mar, 2024 | News

Karlsruhe, March 22, 2024 – Vanguard Automation GmbH, a developer of technology and automated equipment for 3D nano-printing of photonic interconnects, has signed an agreement to join Mycronic, a Swedish high-tech group, listed on NASDAQ OMX Stockholm. Mycronic is...

Fiber-coupled quantum dot single-photon source via photonic wire bonding

13. Mar, 2024 | Conference Publications

M. De Gregorio et al., Proc. SPIE 12911, Quantum Computing, Communication, and Simulation IV, 129110Y (13 March 2024) Photonic wire bonds have been developed as an interface for the collection of single photon emission from quantum dots within a Bragg waveguide. When...

3D-printed aspherical lens with moth-eye anti-reflection structure

13. Mar, 2024 | Conference Publications

Y. Mizuno et al., Proc. SPIE 12898, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII, 128980R (13 March 2024) 3D-printed lens by two photon polymerization is promising technology in the filed of optics thanks to its free-form writing with...

Semiconductor optical amplifier (SOA) integrated on silicon photonic chip using photonic wire bonds (PWBs)

12. Mar, 2024 | Conference Publications

T. Wang, et al., Proc. SPIE 12889, Integrated Optics: Devices, Materials, and Technologies XXVIII, 128890Q (12 March 2024) In this paper, we demonstrate near-C-band semiconductor optical amplifiers (SOAs) integrated on silicon photonic chips using photonic wire bonds...