Photonic Integration Using Industry Ready Photonic Wire Bonds & Facet Attached Micro-Lenses

11. Dec, 2024 | News

Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss, reproducibility, high reliability and packaging compatibility. These attributes are crucial for high-volume production of...

Microresonator photonic wire bond integration for Kerr-microcomb generation

23. Nov, 2024 | Magazine Articles

Scientific Reports | Published: 23 November 2024 Extremely high-Q microresonators provide an attractive platform for a plethora of photonic applications including optical frequency combs, high-precision metrology, telecommunication, microwave generation, narrow...

Bringing Tomorrow’s Photonics to Life with Fully Automated Photonic Wire Bonding and Facet-Attached Micro-Lenses

11. Nov, 2024 | Magazine Articles

SiS Magazine Issue 8, November 2024 Vanguard Automation is enabling a bright future for photonic packaging and integration with scalable industry-ready 3D nano-printing solutions. Our technology driven world of AI (Artificial Intelligence), cloud computing and 5G...

Bringing tomorrow’s photonics to life with fully automated photonic wire bonding and facet-attached micro-lenses

4. Nov, 2024 | News

November 4, 2024: Silicon Semiconductor Magazine – Issue 8 Vanguard Automation is enabling a bright future for photonic packaging and integration with scalable industry-ready 3D nano-printing solutions. OUR TECHNOLOGY DRIVEN world of AI (Artificial Intelligence),...

Standardized low loss fiber array to PIC interface demonstrated with Photonic Wire Bonds

16. Sep, 2024 | News

Karlsruhe, Germany and Lausanne, Switzerland, September 16th, 2024 – Photonic Integrated Circuits (PICs) have been demonstrated with very low on-chip loss in the past, for example with LIGENTEC’s low loss silicon nitride (SiN) PIC platform. The connection of these...