Y. Mizuno et al., 2023 Optical Fiber Communications Conference and Exhibition (OFC), San Diego, CA, USA, 2023, pp. 1-3, doi: 10.1364/OFC.2023.Th2A.8.
We demonstrate 128 Gbaud HB-CDM with InP-based modulator having 3D-printed SSCs on chip facet. Optical coupling loss of 1.1 dB and Telcordia compliant reliability promise practical usage of 3D-print technology based on two photon polymerization.
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