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Semiconductor optical amplifier (SOA) integrated on silicon photonic chip using photonic wire bonds (PWBs)

12. März, 2024 | Conference Publications

T. Wang, et al., Proc. SPIE 12889, Integrated Optics: Devices, Materials, and Technologies XXVIII, 128890Q (12 March 2024) In this paper, we demonstrate near-C-band semiconductor optical amplifiers (SOAs) integrated on silicon photonic chips using photonic wire bonds...

Photonic multi-chip integration enabled by photonic wire bonds (PWB)

21. Dez., 2023 | Conference Publications

Q. Liu et al., Proc. SPIE 12966, AOPC 2023: AI in Optics and Photonics, 129660S (21 December 2023) Photonic wire bonding (PWB) is an enabling technology that allows the combination of the complementary strengths of different optical integration platforms in advanced...

Low-Loss Photonic Wire Bonds and Facet-Attached Micro-Lenses: from Telecom to Quantum Applications

13. Dez., 2023 | Conference Publications

L. E. Horan et al., in British and Irish Conference on Optics and Photonics 2023, (Optica Publishing Group, 2023), paper Th5A.4. (13–15 December 2023) Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility...
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Vanguard Automation GmbH
Gablonzer Strasse 10
76185 Karlsruhe, Germany
T: +49 721 5966 063-0

info.vanguard@mycronic.com

About Vanguard Automation

Vanguard Automation offers machines and processes for 3D nano-printing in the field of photonic integration and packaging. Our solutions cover the full range from small-scale prototyping to fully automated mass production.
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