Photonics Spectra, August 2022
Femtosecond fiber lasers enable 3D nanoprinting to connect components in the high-volume assembly of hybrid photonic integrated circuits, minimizing alignment requirements.
Just as electronic integrated circuits have revolutionized computing, photonic integrated circuits (PICs) are poised to transform applications such as high-speed optical communications, optical signal processing, optical sensing, and quantum information processing.
The vision of unparalleled scalability and automated high-volume production of PICs, enabled by wafer-scale processing technologies of the semiconductor industry, is driving investments of both industry and public institutions. Indeed, high-density photonic integration based on advanced wafer-level processes has been realized for a variety of silicon-based PICs — on the so-called silicon photonics platform.
Read more here.
