The latest news
Vanguard Automation and ETRI Partner to Drive Scalable Photonic Integration in Korea
Karlsruhe, Germany / Daejeon, Korea – October 22, 2025 Vanguard Automation (VA) is delighted to announced today that vanguard's 3D lithography system has been installed at the Electronics and Telecommunications Research Institute (ETRI) in Korea. This milestone marks...
Fraunhofer IZM: A bright future for quantum computing with Photonic Wire Bonding
Fraunhofer IZM, September 2025 Great to see Photonic Wire Bonding technology fabricated with our vanguard Sonata1000 in action for optical quantum processors! Congrats to our partner Fraunhofer IZM and Akhetonics for their SPOC project! Read more here page.
The Essential Link in Next-Generation Optical Connectivity
PIC Magazine Issue 3, September 2025 With industry-ready 3D nano-printing solutions, Vanguard Automation is lighting the path to scalable and reliable processes for integrating active components to PICs Demand is surging for high-performance optics and PICs, driven by...
Vanguard Automation joins MEETOPTICS to expand access to photonics innovation
Vanguard Automation has officially joined MEETOPTICS, the global platform for optics and photonics. This partnership supports our mission to make advanced multi-chip integration and packaging solutions more accessible to engineers and researchers worldwide, empowering...
Industry Proven Photonic Integration Using Photonic Wire Bonds & Facet Attached Micro-Lenses
Photonic wire bonds and facet attached micro-lenses are 3D freeform structures that maintain low-loss optical connectivity and high reliability for photonic packaging and integration. These attributes are critical for mass production of compact optoelectronic devices....
Photonic Integration Using Industry Ready Photonic Wire Bonds & Facet Attached Micro-Lenses
Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss, reproducibility, high reliability and packaging compatibility. These attributes are crucial for high-volume production of...
Bringing tomorrow’s photonics to life with fully automated photonic wire bonding and facet-attached micro-lenses
November 4, 2024: Silicon Semiconductor Magazine – Issue 8 Vanguard Automation is enabling a bright future for photonic packaging and integration with scalable industry-ready 3D nano-printing solutions. OUR TECHNOLOGY DRIVEN world of AI (Artificial Intelligence),...
Standardized low loss fiber array to PIC interface demonstrated with Photonic Wire Bonds
Karlsruhe, Germany and Lausanne, Switzerland, September 16th, 2024 – Photonic Integrated Circuits (PICs) have been demonstrated with very low on-chip loss in the past, for example with LIGENTEC’s low loss silicon nitride (SiN) PIC platform. The connection of these...
Vanguard Automation’s Advanced Photonic Packaging Solution now available at MiQro Innovation Collaborative Centre (C2MI) in Bromont, Canada
Karlsruhe, Germany, May 15th, 2024 — Vanguard Automation (VA), a Mycronic company, is delighted to announce today that the vanguard SYMPHONY has been successfully commissioned at C2MI, Canada’s largest electronic system research and development centre. This equipment...
Revolutionizing Photonic Integration & Packaging: Vanguard Automation’s SONATA 1000 is Now Available at Tyndall National Institute
Karlsruhe, Germany, April 15, 2024 — Vanguard Automation, a Mycronic company, is delighted to announced today that its 3D lithography system, SONATA 1000, has been successfully commissioned at Tyndall National Institute. The PIXAPP pilot line, headquartered at Tyndall...