The latest news
Industry Proven Photonic Integration Using Photonic Wire Bonds & Facet Attached Micro-Lenses
Photonic wire bonds and facet attached micro-lenses are 3D freeform structures that maintain low-loss optical connectivity and high reliability for photonic packaging and integration. These attributes are critical for mass production of compact optoelectronic devices....
Using Industry Ready Photonic Wire Bonds & Facet Attached Micro-Lenses
Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss, reproducibility, high reliability and packaging compatibility. These attributes are crucial for high-volume production of...
Bringing tomorrow’s photonics to life with fully automated photonic wire bonding and facet-attached micro-lenses
November 4, 2024: Silicon Semiconductor Magazine – Issue 8 Vanguard Automation is enabling a bright future for photonic packaging and integration with scalable industry-ready 3D nano-printing solutions. OUR TECHNOLOGY DRIVEN world of AI (Artificial Intelligence),...
Standardized low loss fiber array to PIC interface demonstrated with Photonic Wire Bonds
Karlsruhe, Germany and Lausanne, Switzerland, September 16th, 2024 – Photonic Integrated Circuits (PICs) have been demonstrated with very low on-chip loss in the past, for example with LIGENTEC’s low loss silicon nitride (SiN) PIC platform. The connection of these...
Vanguard Automation’s Advanced Photonic Packaging Solution now available at MiQro Innovation Collaborative Centre (C2MI) in Bromont, Canada
Karlsruhe, Germany, May 15th, 2024 — Vanguard Automation (VA), a Mycronic company, is delighted to announce today that the vanguard SYMPHONY has been successfully commissioned at C2MI, Canada’s largest electronic system research and development centre. This equipment...
Revolutionizing Photonic Integration & Packaging: Vanguard Automation’s SONATA 1000 is Now Available at Tyndall National Institute
Karlsruhe, Germany, April 15, 2024 — Vanguard Automation, a Mycronic company, is delighted to announced today that its 3D lithography system, SONATA 1000, has been successfully commissioned at Tyndall National Institute. The PIXAPP pilot line, headquartered at Tyndall...
Vanguard Automation signs Agreement to join the Swedish High-Tech Group Mycronic
Karlsruhe, March 22, 2024 – Vanguard Automation GmbH, a developer of technology and automated equipment for 3D nano-printing of photonic interconnects, has signed an agreement to join Mycronic, a Swedish high-tech group, listed on NASDAQ OMX Stockholm. Mycronic is...
Plug-and-Play Fiber-Coupled Quantum Dot Single-Photon Source via Photonic Wire Bonding
Single-photon sources are important components in the field of quantum information science. They are good candidates for the creation of critical building blocks for quantum key distribution, quantum computing, and quantum networks. During the last two decades,...
Vanguard Automation delivers Advanced Photonic Integration & Packaging Capabilities to Harvard Center for Nanoscale Systems
Supported by the U.S. National Science Foundation (NSF)-MRI program, the Center for Nanoscale Systems (CNS) -Nanofabrication Facility at Harvard University has acquired Vanguard Automation’s SYMPHONY, a fully automated photonic integration and packaging solution...
Photonic integration and packaging with Photonic Wire Bonding and facet-attached micro-optical elements
September 13, 2023: PIC Magazine – Issue 3, 2023 The rapid growth of photonic integrated circuits is driving the need for fast innovation, and this is made possible by the development of Photonic Wire Bonding (PWB), which creates low-loss, 3D free-form connections...