Upcoming events and exhibitions

Where to find us and view our solutions at international events, webinars and exhibitions around the globe

We look forward to meeting you there, introducing our company and individual products, and listening to your requirements.

September 19 – 21, 2022
ECOC 2022 Basel, Switzerland

We are exhibiting! Come and visit us at booth #579.

September 7 – 9, 2022
CIOE 2022 Shenzhen, China

We are exhibiting! Come and visit us.

June 28 – 29, 2022
PIC International Brussels, Belgium

The 8th PIC International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning four sectors. Attendees at the two-day conference will gain an up-to-date overview of the status of the global photonics industry, and will have the opportunity to meet many other key players within the community. PIC International is part of AngelTech, which delivers a portfolio of insightful, informative, highly valued chip-level conferences. Bringing together 3 conferences, 700+ delegates, 80+ exhibitors, 120+ presentations and numerous networking opportunities, AngelTech is the number one global event covering compound semiconductor, photonic integrated circuit and sensor technologies. With a strong over-lap between the three conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.

You want to learn more about Photinic Wire Bonds? Don’t miss Sebastian Skacel‘s presentation talking about “Enabling next generation photonic integration and packaging solutions with Photonic Wire Bonding” at PIC International Conference on 29 June 2022 at 10.40.

March 1, 2022
Webinar: Optical product innovations with Photonic Wire Bonding

With the growth of Photonic Integrated Circuits comes the need to innovate quickly. And this innovation acceleration is made possible by the creation of Photonic Wire Bonding. In this webinar, three leaders in their space will provide the insights you need to understand this competitive advantage. Vanguard Automation (creator of Photonic Wire Bonding), C2MI (fab/assembly/test capabilities), and AEPONYX (Photonic Integrated Circuit creator) come together to explain the what, how, and why of this breakthrough.

Sign on to webinar now!