Isolator-free integration of a temperature-tuned III-V distributed feedback laser in a silicon photonic package using photonic wire bonding

3. Mar, 2026 | Journal Papers on Photonic Wire Bonds

Venkatesh Deenadayalan, George Nelson, Justin Bickford, Juned Kemal, Stefan Preble; in Journal of Optical Microsystems, Vol. 6, Issue 2, 021002 (February 2026). We present a fully assembled, low-cost, hybrid-integrated distributed feedback (DFB) III-V laser bonded in...

High-power and narrow-linewidth laser on thin-film lithium niobate enabled by photonic wire bonding

1. Feb, 2025 | Journal Papers on Photonic Wire Bonds

Cornelis A. A. et. al.; in APL Photonics 1 February 2025; 10 (2): 026107 Thin-film lithium niobate (TFLN) has emerged as a promising platform for the realization of high-performance chip-scale optical systems, spanning a range of applications from optical...

Using Industry Ready Photonic Wire Bonds & Facet Attached Micro-Lenses

17. Jan, 2025 | Journal Papers on Photonic Wire Bonds

Mo Lu et al., in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2025.3531206. Photonic wire bonds and facet-attached micro-lenses are 3D freeform structures that enable high design flexibility while maintaining low loss,...

On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding

29. Jan, 2024 | Journal Papers on Photonic Wire Bonds

S. J. Chowdhury et al., Opt. Express 32, 3085-3099 (2024) This paper presents a novel co-packaging approach through on-chip hybrid laser integration with photonic circuits using photonic wire bonding. The process involves die-bonding a low-cost semiconductor...

Plug-and-Play Fiber-Coupled Quantum Dot Single-Photon Source via Photonic Wire Bonding

2. Nov, 2023 | Journal Papers on Photonic Wire Bonds

M. De Gregorio et al., Advanced Quantum Technologies, 7.10.1002/qute.202300227 The collection of single-photon emission from a quantum dot (QD) in a Bragg waveguide through a photonic wire bond (PWB) via free-space resonant frequency pumping at 1.6 K is demonstrated....

Cryogenic Optical Packaging Using Photonic Wire Bonds

13. Jul, 2023 | Journal Papers on Photonic Wire Bonds

B. Lin et al., July 2023, 2307.07496 We present the required techniques for the successful low loss packaging of integrated photonic devices capable of operating down to 970 mK utilizing photonic wire bonds. This scalable technique is shown to have an insertion loss...